Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage™ platform. ... We search for industry ...

Ironwood is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build ... To characterize the IC ...

Qualcomm Sets Up Smartphones for Agentic AI with Snapdragon 8 Elite: Summary Qualcomm unveiled the Snapdragon 8 Elite at its Snapdragon Summit, featuring second-gen Oryon CPUs wit ...

The National Institute of Standards and Technology will fund ASU and Deca Technologies up to $100M for SHIELD USA, advancing U.S. microchip packaging. This initiative boosts innovation, reshoring ...

SK hynix has commenced mass production of the world’s first 321-layer triple-level cell NAND flash memory chips. Building on its 238-layer success, the company aims to lead AI storage markets, ...

Samsung Electronics introduces 2nd-generation AI model, Gauss 2: Summary Samsung unveiled its Gauss2 AI model at the Samsung Developer Conference Korea 2024, showcasing enhanced p ...

Nvidia says it will sell more of its next-generation Blackwell chips than previously anticipated: Summary Nvidia’s new Blackwell AI chips are in high demand, with 13,000 units s ...

Summary Chip design has evolved drastically since 1971, yet modern tools often fail to tackle its staggering complexity. Intel's team devel ...

China races to stockpile US chips before Trump ramps up sanctions: Summary China is ramping up US microchip imports, stockpiling $1.11 billion in October, a 60% year-over-year sur ...

European chipmaker STMicroelectronics (STM) will partner with China’s Hua Hong Semiconductor to produce 40-nanometre microcontrollers for China’s auto and industrial markets starting in 2024. This ...

Summary The EDA industry remains highly competitive, with major players like Cadence and Synopsys dominating 90% of the market through internal innovation and AI/ML integration. Despite fewer startups ...

Summary Fan-Out Panel-Level Packaging (FOPLP) is emerging as a scalable, cost-effective solution for advanced nodes, balancing high integration densities with manufacturability. Despite challenges ...